Layers | 2L (with single layer metal board) | |
Board Thickness |
|
1.8 mm |
Material |
|
FR4+MCPCB |
Copper Thickness |
|
2 Oz |
Surface Finish |
|
OSP |
Through lamination process of aluminum based CCL onto regular two-layer/multi-layer FR4 board for the purpose of LED heat conduction.