LIANG DAR
Capability
LIANG DAR
Capability
| ITEM | GENERAL | ADVANCED | PIC. |
| Layer | 1-8 | 10-20 |  |
| Inner Copper Thickness | H-2oz | 2-6oz | |
| Min. Copper Lamination Width | 450 | 450 | |
| Max. Copper Lamination Width | 530 | 530 | |
| ITEM | GENERAL | ADVANCED | PIC. |
| Min. Drilling Diameter Ø | 0.15 | 0.1 | |
| Max. Drilling Diameter Ø | 6.5 | 6.5 | |
NPTH | ±0.1 | ±0.05 | |
PTH | ±0.1 | ±0.05 | |
| NPTH Slot Tolerance | ±0.2 | ±0.1 | |
| PTH Slot Tolerance | ±0.2 | ±0.15 | |
Counterbore Depth | ±0.15 | ±0.1 | |
| Hole Position Tolerance | ±0.075 | ±0.05 | |
| ITEM | GENERAL | ADVANCED | PIC. |
| Max. Dielectric Layer Thickness | 0.12 | 0.12 | |
| Max. Aspect Ratio (PCB thickness/ Blind Hole Diameter) | 0.8 (Thickness: 0.12/Hole Ø:0.15) | 1.0 (Thickness: 0.075/Hole Ø:0.75) | |
| ITEM | GENERAL | ADVANCED | PIC. |
| Max. Aspect Ratio (PCB thickness Y/Hole Diameter) | 6.4 | 8.0 (Thickness: 6.35/Hole Ø:0.500) | |
| ITEM | GENERAL | ADVANCED | PIC. |
| Copper Thickness | T-6.0 | 6.0-10.0 | |
| ITEM | GENERAL | ADVANCED | PIC. |
| Copper Thickness (After Plating) >1oz | 0.102/0.102 | 0.075/0.075 (1/4oz,0.8mil cu plating) | |
| Copper Thickness (After Plating) 1oz | 0.127/0.127 | 0.102/0.102 | |
| Copper Thickness (After Plating) 2oz | 0.203/0.203 | 0.178/0.178 | |
| ITEM | GENERAL | ADVANCED | PIC. |
| Drill Hole to PAD Tolerance | ±0.1 | ±0.075 | |
| Min. Annular Ring | 0.15 | 0.05 | |
| ITEM | GENERAL | ADVANCED | PIC. |
| Min. Solder Mask Bridge | 0.2 | 0.15 | |
| Min. Solder Mask Opening | 0.2 | 0.15 | |
| Min. Solder Mask Opening on Pad | 0.1 | 0.05 | |
| Min. Solder Mask Registration | ±0.050 | ±0.050 | |
| Min. Solder Mask Filled Hole Ø | 0.2 | 0.15 | |
| ITEM | GENERAL | ADVANCED | PIC. |
| Single ended Impedance | 50 | 50 | |
| Differential Impedance | 50/90/100 | 50/90/100 | |