LIANG DAR
Plating Through Hole(Unit:mm)
LIANG DAR
Plating Through Hole(Unit:mm)
描述
| ITEM | GENERAL | ADVANCED | PIC. |
| Max. Aspect Ratio (PCB thickness Y/Hole Diameter) | 6.4 | 8.0 (Thickness: 6.35/Hole Ø:0.500) |  |
| ITEM | GENERAL | ADVANCED | PIC. |
| Max. Aspect Ratio (PCB thickness Y/Hole Diameter) | 6.4 | 8.0 (Thickness: 6.35/Hole Ø:0.500) | |