
LIANG DAR
Capability

LIANG DAR
Capability
ITEM | GENERAL | ADVANCED | PIC. |
Layer | 1-8 | 10-20 | |
Inner Copper Thickness | H-2oz | 2-6oz | |
Min. Copper Lamination Width | 450 | 450 | |
Max. Copper Lamination Width | 530 | 530 |
ITEM | GENERAL | ADVANCED | PIC. |
Min. Drilling Diameter Ø | 0.15 | 0.1 | |
Max. Drilling Diameter Ø | 6.5 | 6.5 | |
NPTH | ±0.1 | ±0.05 | |
PTH | ±0.1 | ±0.05 | |
NPTH Slot Tolerance | ±0.2 | ±0.1 | |
PTH Slot Tolerance | ±0.2 | ±0.15 | |
Counterbore Depth | ±0.15 | ±0.1 | |
Hole Position Tolerance | ±0.075 | ±0.05 |
ITEM | GENERAL | ADVANCED | PIC. |
Max. Dielectric Layer Thickness | 0.12 | 0.12 | |
Max. Aspect Ratio (PCB thickness/ Blind Hole Diameter) | 0.8 (Thickness: 0.12/Hole Ø:0.15) | 1.0 (Thickness: 0.075/Hole Ø:0.75) |
ITEM | GENERAL | ADVANCED | PIC. |
Max. Aspect Ratio (PCB thickness Y/Hole Diameter) | 6.4 | 8.0 (Thickness: 6.35/Hole Ø:0.500) |
ITEM | GENERAL | ADVANCED | PIC. |
Copper Thickness | T-6.0 | 6.0-10.0 |
ITEM | GENERAL | ADVANCED | PIC. |
Copper Thickness (After Plating) >1oz | 0.102/0.102 | 0.075/0.075 (1/4oz,0.8mil cu plating) | |
Copper Thickness (After Plating) 1oz | 0.127/0.127 | 0.102/0.102 | |
Copper Thickness (After Plating) 2oz | 0.203/0.203 | 0.178/0.178 |
ITEM | GENERAL | ADVANCED | PIC. |
Drill Hole to PAD Tolerance | ±0.1 | ±0.075 | |
Min. Annular Ring | 0.15 | 0.05 |
ITEM | GENERAL | ADVANCED | PIC. |
Min. Solder Mask Bridge | 0.2 | 0.15 | |
Min. Solder Mask Opening | 0.2 | 0.15 | |
Min. Solder Mask Opening on Pad | 0.1 | 0.05 | |
Min. Solder Mask Registration | ±0.050 | ±0.050 | |
Min. Solder Mask Filled Hole Ø | 0.2 | 0.15 |
ITEM | GENERAL | ADVANCED | PIC. |
Single ended Impedance | 50 | 50 | |
Differential Impedance | 50/90/100 | 50/90/100 |