LIANG DAR

Capability

LIANG DAR

Capability

ITEMGENERALADVANCEDPIC.
Layer1-810-20
Inner Copper ThicknessH-2oz2-6oz
Min. Copper Lamination Width450450
Max. Copper Lamination Width530530
 

ITEMGENERALADVANCEDPIC.
Min. Drilling Diameter Ø0.150.1
Max. Drilling Diameter Ø6.56.5

NPTH
(Non Plating Through Hole)
Tolerance

±0.1±0.05

PTH
(Plating Through Hole)
Tolerance

±0.1±0.05
NPTH Slot Tolerance±0.2±0.1
PTH Slot Tolerance±0.2±0.15

Counterbore Depth
Tolerance

±0.15±0.1
Hole Position Tolerance±0.075±0.05

ITEMGENERALADVANCEDPIC.
Max. Dielectric Layer
Thickness
0.120.12
Max. Aspect Ratio
(PCB thickness/
Blind Hole Diameter)
0.8
(Thickness:
0.12/Hole Ø:0.15)
1.0
(Thickness:
0.075/Hole Ø:0.75)

ITEMGENERALADVANCEDPIC.
Max. Aspect Ratio
(PCB thickness Y/Hole Diameter)
6.48.0
(Thickness:
6.35/Hole Ø:0.500)

ITEMGENERALADVANCEDPIC.
Copper ThicknessT-6.06.0-10.0

ITEMGENERALADVANCEDPIC.
Copper Thickness
(After Plating) >1oz
0.102/0.1020.075/0.075
(1/4oz,0.8mil cu plating)
Copper Thickness
(After Plating) 1oz
0.127/0.1270.102/0.102
Copper Thickness
(After Plating) 2oz
0.203/0.2030.178/0.178

ITEMGENERALADVANCEDPIC.
Drill Hole to PAD Tolerance±0.1±0.075
Min. Annular Ring0.150.05

ITEMGENERALADVANCEDPIC.
Min. Solder Mask Bridge0.20.15
Min. Solder Mask Opening0.20.15
Min. Solder Mask
Opening on Pad
0.10.05
Min. Solder Mask
Registration
±0.050±0.050
Min. Solder Mask
Filled Hole Ø
0.20.15

ITEMGENERALADVANCEDPIC.
Single ended Impedance5050
Differential Impedance50/90/10050/90/100