LIANG DAR

Working with Liang Dar

LIANG DAR

Working with Liang Dar

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Please provide a Gerber file, CAD file, mechanical design (with PCS dimensions), PNL panelization dimensions, aperture table, and stack-up design. Please also provide information on materials, the copper thickness of finished products, solder mask colors, surface finishing (Lead-Free HASL, ENIG, OSP, etc.), and annual or monthly demand... Detailed information helps us get back to you faster with a more accurate quotation.

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Liang Dar does not have a dedicated metal-core PCB (MCPCB) production line. When there is a demand for MCPCB production, we plan our production according to the properties of different metal boards, such as aluminium boards, copper boards, or single-sided multi-layer metal boards. We also protect the metal boards using appropriate adhesive tape. This prevents the chemicals used on the production line and the MCPCBsfrom interfering with each other, which could impact the product quality.

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When we receive a production request for automotive products, we specify the control points on the production order, so that the production line technicians can easily see the reminder and pay attention to the production conditions. At the same time, we equip each station with automotive product control machines.

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Liang Dar does not have a dedicated sample production line. Samples and mass production share the same production line. Samples are manufactured on the mass production line for simulation, testing whether the process is suitable for mass production. When moving on from samples to mass production, mass production of the same quality as the samples can be achieved without the need to redesign the process.

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High-density interconnector PCB (HDI PCB) is a high-density circuit board with high wiring density. Liang Dar is capable of manufacturing 1-stage and 2-stage HDI boards, which are also called boards with blind and buried vias. We can manufacture multi-layer PCBs with through holes between different copper layers. For example, L1~L2 and L5~L6 blind vias, L2~L3, L3~L4 and L4~L5 buried vias in 6-layer PCBs. However, our ability to manufacture highly depends on Gerber files, copper thickness specifications, aperture table, and so on.

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At Liang Dar, with mechanical drilling, our stabilized process ensures 0.2mm diameters, with 0.15 mm being the smallest diameter we are able to create. For smaller holes, laser drilling should be considered. Laser drilling can stabilize at a 0.05 mm hole diameter. However, to design the size of drilling holes should take plated through holes or blind ones into account.

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The minimum corner radius for CNC milling is 0.5mm. The minimum corner radius using the punching method is 0.3mm. The minimum corner radius using the punching method for metal core boards is 1.0mm.
 
 
 
 

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With finished copper thicknesses under 1 oz using the negative exposure process, a minimum trace width of 75 µm (3 mil) can be achieved. With Laser Direct Imaging (LDI) technology, the minimum trace width can be 35µm or less, contingent on the capabilities of the equipment and the overall manufacturing process.

Contact Us

CONTACT
sales@liangdar.com.tw